Plasma Etching

The surface of the substrate, for example a wafer, gets etched in the plasma with the help of a reactive etching gas. The material gets removed, transfered to the vapor phase and is then exhausted. With the help of this technology, nanostructures can be generated.

Plasma Coating

With the help of plasma functional coatings can be deposited on substrates. Hydrophlic/hydrophibc, scratch resistant, trioboligical optimized and biocompatibility coatings as well as barrier layers can be deposited. Typical layer thickness is around 1 - 10 μm. Different layers can also be deposited on top of one another (so called layer systems).

Plasma Cleaning / Sterilization

Plasma cleans the surface from organic residues by a controlled, cold combustion The great advantage of this method is, that the thermal load of the surface is very low, therefore allowing materials with high thermal sensitivity to be processed.

Plasma Activation

Plasma activation is a another name for plasma functionalization. It is done with the intent to alter or improve adhesion properties prior to coating, gluing or painting etc.